Interface Engineering of Boron Nitride–Polymer Composites for High Thermal Conductivity

ABSTRACT With the rapid miniaturisation and integration of electronic devices, efficient thermal management has become critically important. Boron nitride (BN)‐polymer composites have attracted extensive attention owing to their high thermal conductivity and electrical insulation properties. However, the interfacial thermal resistance between BN and the polymer matrix limits their performance. Consequently, overcoming this bottleneck through interface engineering has emerged as a key research focus. This review systematically examines the current progress in BN‐polymer composites from the perspective of interface engineering. First, the phonon‐mediated heat transfer mechanism and the bottleneck of interfacial thermal resistance are analyzed. Subsequently, various interface engineering strategies are classified according to the forms of interfacial interaction between BN and the polymer. These strategies include covalent bonding, non‐covalent interactions, and physical morphology control. In addition, defect engineering is discussed as an emerging perspective, offering insights into interface design. The effectiveness of the above strategies in establishing continuous thermal conduction pathways and enhancing the performance of the composites is evaluated. Finally, application prospects are summarized and future research directions are proposed.