Fabrication of High‐Resolution 3D Ceramic Electronics Via In Situ Laser‐Activated Selective Electroless Plating

ABSTRACT Customized 3D ceramic electronics are gaining attention for advanced electronics systems due to their exceptional thermal, electrical, and mechanical properties, coupled with the capability to precisely tailor their structural and functional designs to meet specialized application requirements. In this work, we propose a hybrid additive manufacturing approach that combines digital light processing and in situ laser‐activated electroless plating to fabricate high‐precision 3D ceramic electronics. A photopolymer containing low‐temperature co‐fired ceramic (LTCC) and antimony tin oxide (ATO) is developed for 3D printing and subsequent sintering processes. Then, the sintered 3D ceramic can be selectively laser activated in situ to convert the ATO into Sn II plating seeds, enabling metallization via electroless copper plating and electroless nickel immersion gold plating. To validate the feasibility and scalability of the proposed technology, a series of ceramic electronics, including 3D circuits with IC chips, high‐power LED circuits incorporating thermal management channels, and 3D UV sensors with an interdigital electrode array are successfully developed. This technology offers a new pathway for the rapid and cost‐effective customization of high‐performance 3D ceramic electronics, exhibiting great promise for driving innovation in advanced applications such as aerospace and satellite, advanced automotive systems, and next‐generation wireless communication technologies in harsh environments.