Surface stability and electrochemical behavior of additively manufactured copper in repository-relevant environments

The long-term stability of disposal canisters is determined by their corrosion resistance in deep geological disposal environments. This study investigates the surface stability, electrochemical behavior, and mechanical properties of wire arc additively manufactured (WAAM) Cu and Cu alloys compared with forged oxygen-free copper (OFC) in repository-relevant groundwater. Electrochemical experiments and surface characterization under aerobic and anaerobic groundwater conditions were correlated with nanoindentation results. Under aerobic conditions, all materials exhibited comparable corrosion behavior with predominantly uniform corrosion. In contrast, under anaerobic conditions, AM-Cu showed higher corrosion current densities than OFC, associated with heterogeneous surface reactions. Under sulfide-containing environment, the corrosion current density of OFC was approximately 3.5 times lower than AM-Cu, despite the formation of more continuous Cu 2 S corrosion products on AM-Cu. Polarization behavior showed a gradual increase in current density in anodic region for AM-Cu, suggesting less stable surface corrosion-product evolution than that of OFC. Nanoindentation results showed that AM-Cu possesses higher hardness and elastic modulus than OFC, suggesting a trade-off between mechanical strengthening and electrochemical stability. These findings demonstrate that process-induced heterogeneity in AM-Cu affects surface corrosion-product formation and electrochemical behavior under repository-relevant environments.

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Publication Details

Journal
Applied Surface Science
Published
2026-07-17
DOI
https://doi.org/10.1016/j.apsusc.2026.167855
Primary Topic
Electrodeposition and Electroless Coatings
Type
article
Field-Weighted Citation Impact
0.00

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article

Surface stability and electrochemical behavior of additively manufactured copper in repository-relevant environments

Jeong‐Hyun Woo, Yakai Zhao, Seok Yoon, Y LEE et al.
Applied Surface Science
Electrodeposition and Electroless Coatings
article

Surface stability and electrochemical behavior of additively manufactured copper in repository-relevant environments

Jeong‐Hyun Woo, Yakai Zhao, Seok Yoon, Y LEE, Gha-Young Kim, Ju‐Young Kim, Yang-Il Jung, Younghoon Kim, Junhyuk Jang
article en

Abstract

The long-term stability of disposal canisters is determined by their corrosion resistance in deep geological disposal environments. This study investigates the surface stability, electrochemical behavior, and mechanical properties of wire arc additively manufactured (WAAM) Cu and Cu alloys compared with forged oxygen-free copper (OFC) in repository-relevant groundwater. Electrochemical experiments and surface characterization under aerobic and anaerobic groundwater conditions were correlated with nanoindentation results. Under aerobic conditions, all materials exhibited comparable corrosion behavior with predominantly uniform corrosion. In contrast, under anaerobic conditions, AM-Cu showed higher corrosion current densities than OFC, associated with heterogeneous surface reactions. Under sulfide-containing environment, the corrosion current density of OFC was approximately 3.5 times lower than AM-Cu, despite the formation of more continuous Cu 2 S corrosion products on AM-Cu. Polarization behavior showed a gradual increase in current density in anodic region for AM-Cu, suggesting less stable surface corrosion-product evolution than that of OFC. Nanoindentation results showed that AM-Cu possesses higher hardness and elastic modulus than OFC, suggesting a trade-off between mechanical strengthening and electrochemical stability. These findings demonstrate that process-induced heterogeneity in AM-Cu affects surface corrosion-product formation and electrochemical behavior under repository-relevant environments.

Applied Surface ScienceVol. 748
Agency for Science, Technology and Research (SG), Korea Atomic Energy Research Institute (KR), Institute of Materials Research and Engineering (SG), Ulsan National Institute of Science and Technology (KR)
National Research Foundation, National Research Foundation of Korea, Ministry of Science and ICT, South Korea
Openalex Percentile: Top 15%
Electrodeposition and Electroless Coatings
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