Thermal process monitoring for layer adhesion by tracking nozzle position in material extrusion

ABSTRACT: We present a thermal process-monitoring system for MEX tracking layer temperature as a proxy for interlayer adhesion. Python-based hottest-point tracking by infrared thermography is implemented on a chamber-heated desktop printer to track nozzle movements and measure the temperature field millimeters ahead of deposition logging the results on a CSV file. We quantify accuracy versus camera distance (Δd=73mm) and probe radius (R2-R5). Where R3-R4 provided just a ΔRMSE of 1.52°C suggesting R3 as the optimal distance. The results can inform mechanical properties in load-bearing AM applications.