Tribological properties and mechanisms of three kinds of hard thin films for semiconductor shear pin

Purpose This paper aims to investigate the tribological properties and mechanisms of three kinds of PVD/CVD hard thin films for the semiconductor shear pins. Design/methodology/approach TiN and CrN films were prepared via multi-arc ion plating, and diamond-like carbon (DLC) films were prepared via plasma-enhanced chemical vapor deposition (PECVD). Tribological tests on the films were performed using a ball-on-disc tribometer under different normal loads and reciprocating frequencies with different counterparts. Findings The brittleness of the TiN film decreases the load-gearing capacity and results in the severe wear, whereas the CrN film can sustain the tribological oxidation film to resist wear under both loads. Higher frequency promotes the formation of oxides that adhere to the nitrogen-based film to resist wear. The Si3N4 ball could reduce three-body abrasive wear for the TiN film, promote the polishing effect of oxides for the CrN film and activate the graphitization transformation for the DLC film. The DLC film with a strong load-bearing capacity and graphitization transformation during friction exhibits better tribological properties. Originality/value The film properties, tribological test conditions, and friction products jointly affect the tribological behavior of the three films. This paper is beneficial for a better understanding of the tribological mechanisms of the three films.