Absorption-Dominated EMI Shielding in Electrically Insulating Hierarchical Graphene-Coated Glass Fiber/Carbon Black-Reinforced Epoxy Composites

Lightweight polymer composites with effective electromagnetic interference (EMI) shielding are of increasing interest for advanced electronic and aerospace applications; however, conventional glass fiber-reinforced polymers (GFRPs) exhibit inherently low electrical conductivity, limiting their shielding performance. In this study, a hierarchical hybrid conductive architecture was developed by integrating graphene-coated multiaxial glass fiber fabrics with carbon black (CB)-reinforced epoxy matrices to enhance EMI shielding behavior in the X-band (8–12 GHz). Graphene coatings were deposited onto glass fibers via a surfactant-assisted ultrasonic dispersion method, while carbon black (0–1 wt.%) was incorporated into the epoxy matrix using ultrasonication-assisted mixing. Multilayer composites were fabricated using a vacuum bagging process. X-ray diffraction analysis revealed that the composites retained a predominantly amorphous epoxy/glass fiber matrix while exhibiting broad carbon-related diffraction features associated with disordered graphitic domains. Electrical conductivity measurements indicated that all composites remained in the insulating regime (~10−9 S/m), suggesting that a fully interconnected conductive network was not established within the investigated filler range. Despite the absence of a continuous conductive network, measurable EMI shielding performance was achieved. The composite containing 0.25 wt.% CB exhibited the highest shielding effectiveness, reaching approximately 12 dB at ~11.2 GHz. Analysis of the shielding contributions showed that absorption contributions (SEA) were consistently higher than reflection contributions (SER) across the studied frequency range. Morphological observations revealed that well-dispersed CB at low loading facilitated the formation of localized conductive domains that may contribute to tunneling-assisted polarization and interfacial charge accumulation. At higher CB contents, particle agglomeration reduced dispersion quality and limited effective pathway formation, while dynamic mechanical analysis indicated enhanced stiffness at low CB loading. FTIR results confirmed the absence of new chemical bonding, indicating that CB acts as a physically dispersed conductive filler. Overall, the results show that effective EMI shielding can be achieved in electrically insulating composites through the combined effect of hierarchical structural design and localized conductive features. This approach provides a practical pathway for developing lightweight EMI shielding materials with controlled filler loading and preserved structural integrity for aerospace and electronic applications.