Internal State Variable Model of Continuous Dynamic Recrystallization Behavior for Cold Drawn Pure Copper

This study focuses on developing an internal state variable (ISV) model for predicting the flow stress and microstructure evolution of pure copper subjected to cold drawing. The experimental work involved cold drawing of oxygen-free copper to a cumulative strain of 8.1, followed by tensile testing and microstructural analysis using electron backscatter diffraction. Observations revealed progressive grain refinement and transition from low-angle grain boundaries (LAGBs) to high-angle grain boundaries (HAGBs) attributable to continuous dynamic recrystallization (cDRX). The ISV model, incorporating dislocation dynamics and cDRX, successfully predicted trends in flow stress and microstructural characteristics, although certain discrepancies highlight the need for further model refinement. This research advances our understanding of copper’s response to deformation and supports enhanced modeling approaches for industrial applications.