Flexible NiCr–NiSi Thin-Film Thermocouple Sensor for Temperature Monitoring of Telecommunication Equipment

Reliable temperature monitoring is essential for the thermal management and safe operation of modern telecommunication equipment. However, conventional temperature sensors are often relatively large and rigid, which limits their applicability for localized temperature measurement on compact electronic components. In this study, a flexible thin-film thermocouple based on NiCr–NiSi thermoelectric materials was developed for temperature monitoring of telecommunication equipment. The sensor adopts a multilayer structure consisting of a polyimide (PI) flexible substrate, an Al2O3 insulating layer, NiCr and NiSi thermoelectric films, and a SiO protective layer and was fabricated using magnetron sputtering. Static calibration experiments show that the fabricated sensor exhibits a thermoelectric sensitivity of approximately 40.45 µV/°C, which is close to the reference value of conventional K-type thermocouples, with a relative error of about 1.34%. Repeated heating–cooling cycles demonstrate good repeatability and stable thermoelectric characteristics. Dynamic tests under representative transient thermal conditions showed that the sensor could continuously capture temperature variations without signal interruption or abnormal fluctuations. To further quantify its dynamic behavior, a numerical step-response simulation was performed for the PI/Al2O3/NiCr–NiSi/SiO multilayer structure. The simulated thermal time constant and curve-extracted 90% response time were 0.0343 s and 0.0803 s, respectively, under the specified boundary conditions. Owing to its small thickness, low thermal mass, and good mechanical flexibility, the proposed thin-film thermocouple can be conformally attached to compact and curved electronic surfaces, indicating promising potential for real-time localized temperature monitoring of telecommunication equipment and other compact electronic systems.