Thermodynamic Boundaries and Physical-Layer Compliance in AI Compute Infrastructure: Energy-to-Throughput Ratio (ΔETR) and Predictive Thermal Control Under Ultra-Dense Chipsets

As AGI-scale compute expansion and advanced packaging (e.g., CoWoS) push chip-integration density toward physical limits, conventional energy-saving techniques that rely on the operating system, containerized scheduling, or software dynamic voltage-and-frequency scaling (DVFS) are reaching a thermodynamic bottleneck at the edge of compute centers. This paper diagnoses the "Thermodynamic Debt-Shifting Paradox" arising from the industry’s continued reliance on digital equalization and passive liquid-cooling scheduling, and analyzes how fluidic micro-vibration in liquid-cooling loops induces timing jitter and phase decoherence in high-frequency interconnects. To address this long-standing and unmet industrial need, this paper proposes a physical-layer compliance architecture that is independent of the main compute path. The architecture introduces a dimensionless metric, the Energy-to-Throughput Ratio deviation (ΔETR), as a tamper-evident thermodynamic-boundary audit baseline, and combines out-of-band predictive control to perform active phase orchestration before thermodynamic collapse, locking high-frequency timing within ≤ 100 ps. This study further argues, on thermodynamic grounds, the insufficiency of purely software-based scheduling approaches, and explores a physical-layer technical pathway for aligning post-quantum and AGI-scale compute facilities with international green regulations (such as the EU EED and CSDDD). To preserve the novelty of related patents, all circuit-level implementation parameters, trace layouts, control registers, and specific material doping ratios have been de-sensitized; only the high-level, mechanism-tier academic and regulatory-compliance architecture is retained.