Research Progress on Reliable Packaging Technologies for AlGaN‐Based Deep Ultraviolet Light‐Emitting Diodes

ABSTRACT AlGaN‐based deep ultraviolet light‐emitting diodes (DUV‐LEDs) are crucial for applications like disinfection (e.g., against COVID‐19) and non‐line‐of‐sight communication. However, their wall‐plug efficiency (WPE) is typically below 10%, generating significant Joule heat that raises junction temperature, degrading optical output, lifetime, and package reliability. This review systematically summarizes recent advances in reliable packaging technologies to address these challenges. It focuses on three core aspects: (1) Deep ultraviolet‐resistant materials, as high‐energy UV causes photodegradation and yellowing of encapsulants like silicones; (2) Low thermal resistance packaging, optimizing thermal interface materials and heat dissipation paths to control junction temperature; and (3) Reliable hermetic packaging to isolate chips from moisture/oxygen, preventing corrosion and ensuring stability in harsh environments. Finally, we provide a summary and perspective on future developments, offering a reference for advancing high‐performance, reliable DUV‐LED technology.