Optimized Interfacial Layers for High-Adhesion and Damp-Heat-Resistant Cu Meshes with Aperiodic Geometries on PET Substrates

Copper (Cu) thin films and meshes on polyethylene terephthalate (PET) substrates are promising flexible transparent conductive electrodes (TCEs), yet their practical use is limited by insufficient interfacial adhesion and poor oxidative stability on inert polymer substrates. This work addresses these issues via a synergistic strategy of interfacial layer engineering and maskless laser lithography-based aperiodic mesh patterning, systematically comparing ceramic (Al2O3) and metallic (NiCr) interfacial layers for PET-supported Cu films and fabricating Linear/Sinusoidal aperiodic Cu meshes with tailored performance. Magnetron sputtering shows that Ar plasma-activated NiCr interfacial layers form a gradient-alloyed interface with Cu via interdiffusion, achieving 5B-level adhesion, mitigating bending-induced stress concentration, and enhancing damp-heat resistance (85 °C/85% RH) by suppressing oxidation—outperforming brittle Al2O3 layers. Patterning the optimized Cu/NiCr/PET structure into micrometer-scale meshes yields a Linear design with superior optoelectronic performance (~10.8 Ω/sq sheet resistance, >87% transmittance at 550 nm) and a Sinusoidal design with enhanced bending robustness via stress delocalization. Microstructural and elemental analyses clarify the NiCr layer’s interfacial toughening and anti-oxidation mechanisms. Practical validation in flexible transparent heaters demonstrates rapid thermal response and >20 h continuous operational stability. This study provides a scalable design strategy for high-performance PET-supported Cu meshes, offering insights for interface and structural optimization of flexible metallic TCEs for next-generation optoelectronics.