Phase formation and thermal stability of superconducting platinum silicide thin films on silicon

Platinum silicide (PtSi) thin films are promising for silicon-based superconducting quantum devices due to their compatibility with CMOS fabrication, air stability, and superconducting transition temperature near 1 K. We report a systematic study of PtSi phase formation, microstructure, and interface quality as a function of annealing temperature and duration, characterizing films using grazing-incidence x-ray diffraction, x-ray reflectivity, and electrical transport measurements. Phase-pure PtSi forms within minutes by rapid thermal processing at 600 °C and is stable under extended annealing, while 30 s anneals across 300–600 °C yield equivalent film quality with consistent microstructure and superconducting properties. X-ray reflectivity reveals that interfacial roughening is an intrinsic consequence of the Pt2Si-to-PtSi conversion step rather than a result of elevated temperature or prolonged annealing. These results establish a robust processing window for PtSi formation in silicon-based superconducting device fabrication flows.