Fast Electromigration Analysis of Multi-segment Interconnects Based on Recurrent Neural Networks

Predicting electromigration (EM) stress is a critical reliability challenge in power delivery networks. Existing semi-analytical Multilayer Perceptron (MLP) models neglect the Markovian sequential dependencies of EM diffusion and suffer from severe scalability issues due to global topological evaluations. To address these architectural and computational bottlenecks, this paper proposes a dynamic spatiotemporal stress forecasting framework. Specifically, a physics-aligned Recurrent Neural Network (RNN) is constructed to directly model the Markovian sequential evolution of EM stress. This is integrated with a tensor mapping-based dynamic local subgraph extraction strategy, effectively isolating spatial complexity from the global interconnect scale. At the numerical integration level, we develop a physics-driven adaptive hybrid convolution algorithm. Regulated by a stress relaxation time constant, this algorithm dynamically invokes discrete convolution during the early acceleration phase to strictly preserve the abrupt variations of the auxiliary function used for stress computation, and seamlessly switches to Gauss-Legendre quadrature during stable periods to maximize precision while eliminating smoothing artifacts. Furthermore, a simulation-time-based optimization strategy is incorporated to mitigate the prediction error gap between early and late simulation stages. Experimental results validate the efficiency of the proposed framework. Compared to the MLP baseline, our model achieves up to a 93.2% reduction in relative error and a 117.79× computational speedup. Against the Finite Element Method (FEM), it delivers up to 1335.6× acceleration while maintaining engineering-grade accuracy.

Authors

Institutions

Publication Details

Journal
ACM Transactions on Design Automation of Electronic Systems
Published
2026-06-08
DOI
https://doi.org/10.1145/3819829
Primary Topic
Copper Interconnects and Reliability
Type
article
Field-Weighted Citation Impact
0.00
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Fast Electromigration Analysis of Multi-segment Interconnects Based on Recurrent Neural Networks

Xiaoming Xiong, Shuting Cai, Li Y, Zihui Zhang et al.
ACM Transactions on Design Automation of Electronic Systems
Copper Interconnects and Reliability
article

Fast Electromigration Analysis of Multi-segment Interconnects Based on Recurrent Neural Networks

Xiaoming Xiong, Shuting Cai, Li Y, Zihui Zhang, Shiqi Lin, Peng Gao, Junhui Zheng, Fei Yu, Jianjun Liu, Huailin Xu
article en

Abstract

Predicting electromigration (EM) stress is a critical reliability challenge in power delivery networks. Existing semi-analytical Multilayer Perceptron (MLP) models neglect the Markovian sequential dependencies of EM diffusion and suffer from severe scalability issues due to global topological evaluations. To address these architectural and computational bottlenecks, this paper proposes a dynamic spatiotemporal stress forecasting framework. Specifically, a physics-aligned Recurrent Neural Network (RNN) is constructed to directly model the Markovian sequential evolution of EM stress. This is integrated with a tensor mapping-based dynamic local subgraph extraction strategy, effectively isolating spatial complexity from the global interconnect scale. At the numerical integration level, we develop a physics-driven adaptive hybrid convolution algorithm. Regulated by a stress relaxation time constant, this algorithm dynamically invokes discrete convolution during the early acceleration phase to strictly preserve the abrupt variations of the auxiliary function used for stress computation, and seamlessly switches to Gauss-Legendre quadrature during stable periods to maximize precision while eliminating smoothing artifacts. Furthermore, a simulation-time-based optimization strategy is incorporated to mitigate the prediction error gap between early and late simulation stages. Experimental results validate the efficiency of the proposed framework. Compared to the MLP baseline, our model achieves up to a 93.2% reduction in relative error and a 117.79× computational speedup. Against the Finite Element Method (FEM), it delivers up to 1335.6× acceleration while maintaining engineering-grade accuracy.

ACM Transactions on Design Automation of Electronic Systems
Guangdong University of Technology (CN), Guangdong Hiway Integrated Circuit Technology (China) (CN)
Openalex Percentile: Top 15%
Copper Interconnects and Reliability
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.