Crack-Free Precision during Desiccation: Optimizing Aerosol Jet Printing for High-Performance Conductive Microstructure Manufacturing

Aerosol jet printing (AJP) is a high-resolution additive manufacturing technique that enables the deposition of conductive materials onto diverse substrates. However, a significant challenge in AJP is the occurrence of cracking in printed lines, which undermines both electrical conductivity and structural integrity. Herein, we examine the desiccation-induced cracking mechanism in AJP and introduce optimization strategies to mitigate cracking and enhance the conductivity of printed silver lines. Through a detailed analysis of crack morphology and distribution, key factors such as the deposition thickness and overspray regions are identified. The proposed optimizations, comprising regulation of the deposition thickness, enhancement of resolution, and minimization of overspray, yielded crack-free, high-quality silver lines with superior conductivity. These findings offer crucial insights for the advancement of reliable conductive structures in conformal electronics and microelectronics applications.