Optimization of pressure drop and power consumption in microchannels based on fin structure design

Purpose With the continuous increase in the power density of electronic devices, their risk of thermal failure has risen significantly, posing severe challenges to their reliability. Although microchannel cooling technology can effectively control device temperatures, the internal fin structures, while enhancing heat transfer, also introduce high flow resistance and pump power consumption, thereby constraining system energy efficiency and long-term operational reliability. This paper aims to achieve synergistic optimization of efficient heat dissipation and low flow power consumption through structural optimization design, thereby reducing device operating temperatures and comprehensively improving their operational reliability. Design/methodology/approach A multi-stage collaborative optimization strategy for cylindrical finned structures is proposed. First, the effects of different shapes of perforated structures on flow and heat transfer are investigated, and the cylindrical perforated fin with the best overall performance is selected. Subsequently, a through-flow channel is introduced, and a secondary optimization is implemented by incorporating an arc-shaped flow guide contour. The finite element multiphysics simulation method is used to systematically analyze the temperature distribution, flow characteristics and energy consumption performance of the optimized structure. The accuracy of the model is verified through grid independence analysis and comparison with results from existing literature. Findings The perforated structure can effectively eliminate large-scale vortices in the backflow region of the fins, significantly reducing flow resistance while substantially maintaining the heat dissipation capacity. The cylindrical perforated structure achieves a maximum pressure drop reduction of 31.3%, with a 26.2% decrease in pumping power. After further optimization, the pressure drop is reduced by an additional 15.8%, and the pumping power decreases by 16.9%. The system maintains low-temperature operation while significantly reducing energy consumption, which helps enhance the thermal management and long-term operational reliability of the device. Originality/value This study achieves efficient thermal control of microchannel cooling systems under low pressure drop through multi-stage structural optimization, providing new insights for the thermal reliability design of high-power electronic devices. This method effectively reduces energy consumption while enhancing heat dissipation efficiency, demonstrating both engineering applicability and potential for reliability improvement.