Fast TDDB Hotspot Detection of Large-Scale BEOL Circuits Using Physics-Informed Central Emphasized CNN
Time-Dependent Dielectric Breakdown (TDDB) has emerged as a critical reliability concern in Back-End-of-Line (BEOL) interconnects. In Electric Path Generation (EPG) based TDDB analysis, the evolution of metal ion concentration is governed by a Partial Differential Equation (PDE). Traditional numerical methods for solving this equation are time-consuming and demand considerable computational resources, making them impractical for large-scale circuits analysis. To address this challenge, we propose a physics-informed learning framework for fast prediction of ion concentration distributions in large BEOL layouts. The framework represents BEOL patterns as two-dimensional images, partitions large layouts into overlapping sub-graphs for encoding, and predicts transient concentration fields for each sub-graph. Based on the reconstructed full-layout concentration map, the method supports efficient TDDB hotspot analysis. The proposed Physics-Informed Central Emphasized Convolutional Neural Network (PICE-CNN) is applicable to diverse interconnect patterns and operating conditions, including different line widths, line spacings, and supply voltages. Experimental results show that the proposed method achieves up to 357.1 × speedup over conventional numerical solvers while maintaining high prediction accuracy, with the mean squared error below 1 × 10 − 4 in the emphasized central region.
Authors
- Haibao Chen (ORCID: https://orcid.org/0000-0002-3771-2971)
- Xiaoman Yang (ORCID: https://orcid.org/0000-0001-8658-0197)
- Wenjie Zhu (ORCID: https://orcid.org/0009-0007-4213-6765)
- Runsheng Wang (ORCID: https://orcid.org/0000-0002-7514-0767)
- Pengpeng Ren (ORCID: https://orcid.org/0009-0001-2986-9231)
- Xunsheng Tan (ORCID: https://orcid.org/0009-0000-7130-4448)
- Zhigang Ji (ORCID: https://orcid.org/0000-0003-1138-804X)
Institutions
- Shanghai Jiao Tong University (CN)
- Peking University (CN)
Publication Details
- Journal
- ACM Transactions on Design Automation of Electronic Systems
- Published
- 2026-05-22
- DOI
- https://doi.org/10.1145/3812547
- Primary Topic
- Copper Interconnects and Reliability
- Type
- article
- Field-Weighted Citation Impact
- 0.00