Development of an IGBT Dynamic–Static Test Platform and a Multi-Parameter Evaluation Method for Bridge-Arm Consistency in IGBT Modules

To address the need for dynamic and static parameter testing of IGBT modules, an integrated test platform was developed. In production-line applications, consistency differences in key parameters between the upper and lower bridge arms of manufactured modules were found to be difficult to quantify using a single metric. To overcome this limitation, a multi-parameter consistency evaluation method was proposed. Based on more than 400 sets of production-level measurements obtained from newly manufactured IGBT modules from the same batch, eight key parameters, including Eon, Eoff, dv/dt, di/dt, VCES, ICES, VGEth and IGES, were selected to construct paired samples of the upper and lower bridge arms. A dimensionless consistency index (CI) was introduced to quantify relative deviations between bridge arms, and consistency characteristics were analyzed using raw-parameter boxplots, CI boxplots, and paired scatter plots in terms of distribution, discrepancy quantification, and sample-wise pairing. The results show that different parameters exhibit different levels of distributional difference and relative deviation between the two bridge arms under identical test conditions, and that the three analyses reveal mutually consistent trends. The proposed method provides an effective basis for within-batch quality assessment, bridge-arm matching, abnormal sample identification, and production process troubleshooting.

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Publication Details

Journal
Electronics
Published
2026-05-22
DOI
https://doi.org/10.3390/electronics15112237
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
0.00

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article

Development of an IGBT Dynamic–Static Test Platform and a Multi-Parameter Evaluation Method for Bridge-Arm Consistency in IGBT Modules

Z Y Zhang, Yongjun Zheng, Chunsheng Yang, Bin Guo et al.
Electronics
Silicon Carbide Semiconductor Technologies
article

Development of an IGBT Dynamic–Static Test Platform and a Multi-Parameter Evaluation Method for Bridge-Arm Consistency in IGBT Modules

Z Y Zhang, Yongjun Zheng, Chunsheng Yang, Bin Guo, Yi Lu
article en

Abstract

To address the need for dynamic and static parameter testing of IGBT modules, an integrated test platform was developed. In production-line applications, consistency differences in key parameters between the upper and lower bridge arms of manufactured modules were found to be difficult to quantify using a single metric. To overcome this limitation, a multi-parameter consistency evaluation method was proposed. Based on more than 400 sets of production-level measurements obtained from newly manufactured IGBT modules from the same batch, eight key parameters, including Eon, Eoff, dv/dt, di/dt, VCES, ICES, VGEth and IGES, were selected to construct paired samples of the upper and lower bridge arms. A dimensionless consistency index (CI) was introduced to quantify relative deviations between bridge arms, and consistency characteristics were analyzed using raw-parameter boxplots, CI boxplots, and paired scatter plots in terms of distribution, discrepancy quantification, and sample-wise pairing. The results show that different parameters exhibit different levels of distributional difference and relative deviation between the two bridge arms under identical test conditions, and that the three analyses reveal mutually consistent trends. The proposed method provides an effective basis for within-batch quality assessment, bridge-arm matching, abnormal sample identification, and production process troubleshooting.

ElectronicsVol. 15(11)
National Institute of Measurement and Testing Technology (CN), Zhejiang Lab (CN), China Jiliang University (CN)
National Key Research and Development Program of China
Openalex Percentile: Top 9%
Silicon Carbide Semiconductor Technologies
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Development of an IGBT Dynamic–Static Test Platform and a Multi-Parameter Evaluation Method for Bridge-Arm Consistency in IGBT Modules — Z Y Zhang, Yongjun Zheng, et al. · Electronics (2026) | TGRS Research Map | TGRS