Atmospheric-Pressure Plasma Polymerization of Fluorosilane Coatings for Suppressing DC Surface Flashover on Polystyrene

Direct current (DC) surface flashover on polystyrene (PS) remains a critical bottleneck that impedes its reliable application in high-voltage insulation apparatus. To circumvent the protracted processing durations and stringent film-forming conditions inherent in conventional surface modification techniques, this study proposes a novel “liquid-film-assisted in situ rapid plasma curing” strategy. By harnessing atmospheric-pressure dielectric barrier discharge (DBD) technology within an argon ambient, the rapid (<6 min) and efficient deposition of a fluorosilane (FAS-13) functional coating onto the substrate was achieved. Microscopic characterizations coupled with isothermal surface potential decay (SPD) measurements reveal that this coating substantially mitigates the detrapping and surface migration of charge carriers. Macroscopic DC flashover testing corroborates that, under the optimal modification ratio, the surface breakdown voltage of PS is elevated to 14.04 kV, yielding an insulation gain of 26.94%. To elucidate the underlying physical mechanisms, density functional theory (DFT) calculations were conducted, revealing that the energy band misalignment between the wide-bandgap fluorinated layer and the substrate facilitates the construction of a high-density deep trap network (with a depth of ~0.8 eV) at the coating–substrate interface. By robustly anchoring primary electrons and inducing the formation of a homopolar space charge shielding layer, these deep traps physically arrest the evolution of the secondary electron emission avalanche (SEEA). Consequently, this work not only establishes a viable engineering framework for the rapid, large-scale surface reinforcement of DC insulation equipment but also provides profound quantum chemical insights into interfacial trap regulation within all-organic dielectrics.