Sn-Coated Cu Solder Paste for Power Devices Based on Transient Liquid Phase Bonding

Cu is widely employed in power device packaging materials owing to its excellent electrical and thermal conductivity, coupled with economic viability. Sintered Cu currently stands as one of the representative interconnect materials in power device packaging. However, it is prone to oxidation during bonding, requires extended bonding times, and needs considerable pressure. Transient liquid phase bonding (TLPB) technology is regarded as a viable solution for power device packaging, enabling high-melting-point, high-strength, and thermally stable connections at low temperatures. Cu and Sn are widely employed metallic materials in common TLP systems. The Sn-coated Cu particle increases the effective reaction area between Cu and Sn, accelerating the formation of intermetallic compounds (IMCs) and reducing bonding time. Sn-coated Cu particles were produced in this study by chemically plating Sn onto micron-sized Cu powder surfaces. The effects of flux content, bonding time, and applied pressure on joint shear strength were investigated. Results indicate that as flux content increases, the shear strength of the solder joints initially increases and then decreases. The shear strength of the solder joint gradually decreased with increasing bonding time, but no significant change was observed when the time exceeded 20 min. Increasing the applied pressure significantly enhanced the shear strength of the solder joint. The shear strength of the solder joint at 10 MPa is 90.2% higher than at 5 MPa.