In Situ Holographic Monitoring of Stress Corrosion Dynamics of Alloy 625 in Cl− + S2O32− Solution

This study examined the stress corrosion of Alloy 625 in Cl− + S2O32− solutions using digital holography in combination with electrochemical methods. Without elastic tensile stress, intergranular corrosion (IGC) occurred, due to the higher activity of grain boundaries compared to the grain interior and to preferential adsorption of sulfur (produced by S2O32− decomposition) at these boundaries. Digital holography observations showed that IGC initiated at certain grain boundaries and propagated to adjacent boundaries, even in the absence of elastic tensile deformation. Applying elastic tensile stress (260 MPa, ~46% σy) increased the defect density within the oxide film, thereby enhancing corrosion and anodic currents, and inducing river-like cracks. Although elastic tensile stress suppressed IGC, it simultaneously promoted stress corrosion cracking (SCC), as the stress exerted a stronger accelerating effect on corrosion than the grain-boundary did. Digital holography allowed in situ monitoring of the stress corrosion process in Alloy 625, demonstrating that cracks initiated via localized corrosion/IGC and subsequently propagated along the direction of the applied stress.