Abrasive Materials for Semiconductor Chemical Mechanical Polishing: Composition, Performance, and Emerging Trends
has unique chemical activity and high selectivity, which is advantageous in the shallow trench isolation (STI) process. This review analyzes the current challenges (defect control, slurry stability, environmental constraints) and emerging trends (composite abrasive design, sustainable manufacturing). It provides technical insights for the development of high-precision and high-efficiency CMP processes in semiconductor manufacturing.
Institutions
- Northwestern Polytechnical University (CN)
- Henan University (CN)
- China State Shipbuilding (China) (CN)
- Luoyang Institute of Science and Technology (CN)
Publication Details
- Journal
- ACS Applied Materials & Interfaces
- Published
- 2026-05-19
- DOI
- https://doi.org/10.1021/acsami.6c04556
- Primary Topic
- Advanced Surface Polishing Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Major Scientific and Technological Project of Zhejiang Province