Improved Viscoelastic Numerical Simulation and In Situ Dynamic FBG Sensing of Interfacial Curing Stress Concentration in Epoxy Insulation Materials

Interfacial stress concentration induced by curing shrinkage during the manufacturing of epoxy resin is a primary trigger for micro-nano defect formation and electrical performance degradation in power equipment. To address the computational complexity of traditional viscoelastic models and the thermoelastic behavior wherein the stiffness of the epoxy resin varies with temperature during curing, this paper proposes an improved viscoelastic constitutive model incorporating a thermo-elastic factor. By coupling curing kinetics, heat conduction, chemical shrinkage, and mechanical effects, a multi-physics simulation framework is constructed to describe the complete epoxy curing process, thereby revealing the spatiotemporal evolution of curing stress deformation. To verify the model’s accuracy, an in situ monitoring system based on Fiber Bragg Grating (FBG) sensors was established. A temperature compensation method was utilized to effectively decouple temperature and stress within the complex exothermic curing environment. This study reveals a significant strain gradient effect during the resin curing process. Experimental measurements indicate strains of 21,609 με and 5800 με at the interface and surface, respectively, with numerical simulations exhibiting high agreement with the experimental data. This research not only provides an efficient simulation approach for predicting curing stress but also offers a theoretical basis for the crack-resistant structural design of high-performance epoxy-based power equipment.