Structural design and 3D printing of flexible integrated electronic systems
Abstract Flexible electronic systems are rapidly advancing for applications in health monitoring, human‐machine interaction, and intelligent robotics. Their reliable operation requires the coordinated integration of sensing, computational, and energy modules, imposing stringent demands on structural design and manufacturing strategies. 3D printing offers unique advantages for constructing such systems owing to its exceptional design freedom and broad material compatibility. This review summarizes recent advances in 3D printed flexible integrated electronics and establishes links between structural design, 3D printing techniques, and various applications. We first focus on structural design strategies for individual components, such as sensors and energy storage devices, from morphological structures and dimensional engineering, while also considering system‐level integration strategies. We then review the preparation of the above‐mentioned structural devices through diverse 3D printing techniques, and discuss their representative applications in energy autonomous systems, real‐time monitoring platforms, and flexible robotics. Finally, we outline the key opportunities and development directions for advancing next‐generation 3D‐printed highly‐integrated flexible electronic systems.
Authors
- Zhiyang Lyu (ORCID: https://orcid.org/0000-0002-4305-4047)
- Jiani Gong
- Chi Guo (ORCID: https://orcid.org/0000-0003-2022-2121)
- X Chen
- Yuehua Chen (ORCID: https://orcid.org/0009-0006-1343-7449)
- Yi-Xiang Wang (ORCID: https://orcid.org/0000-0002-5246-5497)
- Changsong Shi
- Jie Tao
- Songze Fu
Institutions
- University of Nottingham (GB)
- Army Medical University (CN)
- Southeast University (BD)
- Daping Hospital (CN)
- Southeast University (CN)
Publication Details
- Journal
- FlexMat.
- Published
- 2026-05-17
- DOI
- https://doi.org/10.1002/flm2.70095
- Primary Topic
- Advanced Sensor and Energy Harvesting Materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00