<scp>3D</scp> Surface‐Modified Spherical Graphite for Enhancing the Thermal Conductivity of Epoxy Resins

ABSTRACT This study fabricates crown‐like 3D‐structured brochantite nanocrystal‐modified spherical graphite (Cu@SG) via polydopamine (PDA)‐assisted chemical plating, and integrates it with epoxy resin (EP) to prepare high‐thermal‐conductivity composites. XRD, FTIR, and SEM characterizations show PDA enables uniform brochantite deposition via interfacial coordination, forming an SG‐PDA‐brochantite structure without damaging SG's graphitic structure (ID/IG ratio only rising from 0.22 to 0.24). At 20 wt% filler content, Cu@SG/EP achieves through‐plane and in‐plane thermal conductivities of 1.198 W/(m K) and 1.536 W/(m K), increasing by 311.1% and 398.9% versus pure EP, and 57.6% and 22.0% versus unmodified SG/EP. Despite a 10.6% flexural strength reduction, the multiscale thermal network boosts conductivity remarkably. This PDA‐assisted metallization strategy provides a new route for carbon‐based filler modification, with promising applications in electronic packaging and new energy thermal management.

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Publication Details

Journal
Journal of Applied Polymer Science
Published
2026-05-12
DOI
https://doi.org/10.1002/app.70852
Primary Topic
Thermal properties of materials
Type
article
Field-Weighted Citation Impact
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article

3D Surface‐Modified Spherical Graphite for Enhancing the Thermal Conductivity of Epoxy Resins

Xun Sun, Shanshan Yao
Journal of Applied Polymer Science
Thermal properties of materials
article

3D Surface‐Modified Spherical Graphite for Enhancing the Thermal Conductivity of Epoxy Resins

Xun Sun, Shanshan Yao
article en

Abstract

ABSTRACT This study fabricates crown‐like 3D‐structured brochantite nanocrystal‐modified spherical graphite (Cu@SG) via polydopamine (PDA)‐assisted chemical plating, and integrates it with epoxy resin (EP) to prepare high‐thermal‐conductivity composites. XRD, FTIR, and SEM characterizations show PDA enables uniform brochantite deposition via interfacial coordination, forming an SG‐PDA‐brochantite structure without damaging SG's graphitic structure (ID/IG ratio only rising from 0.22 to 0.24). At 20 wt% filler content, Cu@SG/EP achieves through‐plane and in‐plane thermal conductivities of 1.198 W/(m K) and 1.536 W/(m K), increasing by 311.1% and 398.9% versus pure EP, and 57.6% and 22.0% versus unmodified SG/EP. Despite a 10.6% flexural strength reduction, the multiscale thermal network boosts conductivity remarkably. This PDA‐assisted metallization strategy provides a new route for carbon‐based filler modification, with promising applications in electronic packaging and new energy thermal management.

Journal of Applied Polymer Science
Jilin University of Chemical Technology (CN)
Affordable and clean energy
Openalex Percentile: Top 9%
Thermal properties of materials
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