Mechanistic Insights into Thermal Degradation of High-Concentration SF <sub>6</sub> over TiO <sub>2</sub> –SiC Heterojunction

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Journal
Langmuir
Published
2026-05-09
DOI
https://doi.org/10.1021/acs.langmuir.6c01612
Primary Topic
Copper Interconnects and Reliability
Type
article
Field-Weighted Citation Impact
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article

Mechanistic Insights into Thermal Degradation of High-Concentration SF 6 over TiO 2 –SiC Heterojunction

Xuefeng Qian, Boxu Dong, Shan Zhu, Jiantao Zai et al.
Langmuir
Copper Interconnects and Reliability
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Mechanistic Insights into Thermal Degradation of High-Concentration SF 6 over TiO 2 –SiC Heterojunction

Xuefeng Qian, Boxu Dong, Shan Zhu, Jiantao Zai, Fengxiang Ma, Yue Zhao, Yujia Qian, Yaru Zhang, Menghan Yang, Luyao Li
article en

Abstract

No abstract available for this paper.
Langmuir
Electric Power Research Institute (US), Shanghai Jiao Tong University (CN), Institute for Renewable Energy (Poland) (PL)
State Grid Corporation of China
Openalex Percentile: Top 13%
Copper Interconnects and Reliability
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