Study on Grinding Wheel Wear and Machining Quality in Ultrasonic Vibration Helical Grinding of SiC _f /SiC Composites

ABSTRACT SiC f /SiC composites are widely used in aerospace due to their superior strength, high‐temperature resistance, and low density. Their component connection mainly relies on assembly holes, but during machining, grinding wheels are prone to wear, leading to reduced precision and higher processing costs. To reveal the wheel wear mechanism and its influence on machining quality, this study adopts ultrasonic helical grinding to investigate the wear characteristics of grinding wheels during hole making of SiC f /SiC composites. A model for the residual fillet radius at hole exits has been established. The evolution laws of grinding force, wheel wear, and hole quality are analyzed, along with the intrinsic correlation between wheel wear and machining performance, and the suppression mechanism of ultrasonic vibration on wheel wear. Findings show that as grinding proceeds, wheel wear intensifies, grinding force gradually increases, and hole precision declines, with wheel wear exerting a more notable influence on hole exit diameter. The residual fillet radius model has an error within 10%, enabling effective prediction of hole exit machining accuracy. Ultrasonic vibration significantly inhibits wheel wear in helical grinding, it extends wheel lifespan, alleviates damage at hole entry and exit interfaces, and enhances machining accuracy.