Focus Session: Advanced CMOS and 5.5D Packaging: Perspectives and Challenges for Design, Reliability and Security

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Publication Details

Journal
HAL (Le Centre pour la Communication Scientifique Directe)
Published
2026-04-20
Primary Topic
3D IC and TSV technologies
Type
article
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article

Focus Session: Advanced CMOS and 5.5D Packaging: Perspectives and Challenges for Design, Reliability and Security

Jérome Toublanc, Dragomir Milojevic, Hussam Amrouch, Giorgio Di Natale
HAL (Le Centre pour la Communication Scientifique Directe)
3D IC and TSV technologies
article

Focus Session: Advanced CMOS and 5.5D Packaging: Perspectives and Challenges for Design, Reliability and Security

Jérome Toublanc, Dragomir Milojevic, Hussam Amrouch, Giorgio Di Natale
article en

Abstract

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HAL (Le Centre pour la Communication Scientifique Directe)
Openalex Percentile: Top 7%
3D IC and TSV technologies
OpenAlex
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