Machine learning-driven hardness modeling and interpretable analysis of constitutive characteristics for thin copper films

Purpose Copper (Cu) thin films have been widely studied and applied in microelectronic devices due to their low resistivity, high melting point, good adhesion to various substrates and low electron mobility. In this paper, a complete workflow for machine learning (ML)-based hardness prediction of Cu thin films is proposed. This work effectively captures the nonlinear relationships between the physical properties such as elastic modulus, externally applied pressure, displacement and grain size of Cu thin films. Design/methodology/approach Four models – random forest (RF), extreme gradient boosting (XGBoost), K-nearest neighbors and gradient boosting decision tree – were established. In order to improve the prediction accuracy of the models, the particle swarm optimization algorithm was employed. Findings The R2 of all four models was greater than 0.85, the mean absolute error (MAE) was less than 0.16 and the root mean square error (RMSE) was less than 0.1. The XGBoost model after optimization demonstrated the best performance, attaining a 91% hit rate on the independent test set, with MAE and RMSE values of 0.0743 and 0.1227, respectively. Research limitations/implications The conventional approach for fabricating Cu thin films relies on traditional experimental methods, which often entail prolonged experimental periods and elevated time costs. Practical implications ML methods can simultaneously learn from existing data and predict the hardness of Cu thin films, thereby reducing experimental and time costs while maintaining predictive accuracy. Originality/value Leveraging advanced ML techniques, we developed a novel PSO-XGBoost hybrid framework to unravel complex nonlinear interactions among physicochemical properties of Cu thin films. This integrated approach achieved exceptional predictive performance, yielding 91% classification accuracy on an independent test dataset with MAE of 0.0743 and RMSE of 0.1227. These metrics demonstrate significant performance improvements over conventional statistical models, underscoring the model's capability to capture intricate material behavior patterns.

Authors

Institutions

Publication Details

Journal
Engineering Computations
Published
2026-05-08
DOI
https://doi.org/10.1108/ec-09-2025-1079
Primary Topic
Microstructure and mechanical properties
Type
article
Field-Weighted Citation Impact
0.00
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Machine learning-driven hardness modeling and interpretable analysis of constitutive characteristics for thin copper films

MingYang Zuo, Jiayin Song, Shuhao Wang, Li Tian et al.
Engineering Computations
Microstructure and mechanical properties
article

Machine learning-driven hardness modeling and interpretable analysis of constitutive characteristics for thin copper films

MingYang Zuo, Jiayin Song, Shuhao Wang, Li Tian, Ming Wang, Jie Sun
article en

Abstract

Purpose Copper (Cu) thin films have been widely studied and applied in microelectronic devices due to their low resistivity, high melting point, good adhesion to various substrates and low electron mobility. In this paper, a complete workflow for machine learning (ML)-based hardness prediction of Cu thin films is proposed. This work effectively captures the nonlinear relationships between the physical properties such as elastic modulus, externally applied pressure, displacement and grain size of Cu thin films. Design/methodology/approach Four models – random forest (RF), extreme gradient boosting (XGBoost), K-nearest neighbors and gradient boosting decision tree – were established. In order to improve the prediction accuracy of the models, the particle swarm optimization algorithm was employed. Findings The R2 of all four models was greater than 0.85, the mean absolute error (MAE) was less than 0.16 and the root mean square error (RMSE) was less than 0.1. The XGBoost model after optimization demonstrated the best performance, attaining a 91% hit rate on the independent test set, with MAE and RMSE values of 0.0743 and 0.1227, respectively. Research limitations/implications The conventional approach for fabricating Cu thin films relies on traditional experimental methods, which often entail prolonged experimental periods and elevated time costs. Practical implications ML methods can simultaneously learn from existing data and predict the hardness of Cu thin films, thereby reducing experimental and time costs while maintaining predictive accuracy. Originality/value Leveraging advanced ML techniques, we developed a novel PSO-XGBoost hybrid framework to unravel complex nonlinear interactions among physicochemical properties of Cu thin films. This integrated approach achieved exceptional predictive performance, yielding 91% classification accuracy on an independent test dataset with MAE of 0.0743 and RMSE of 0.1227. These metrics demonstrate significant performance improvements over conventional statistical models, underscoring the model's capability to capture intricate material behavior patterns.

Engineering Computations
Northeastern University (US), Liaoning Technical University (CN), Line Corporation (Japan) (JP)
Openalex Percentile: Top 10%
Microstructure and mechanical properties
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.