Recycling of Scrap Metal from Multifunctional Aluminum-Based Electronic Device Housings

Aluminum multifunctional housings can enhance circularity in electronics by replacing polymer enclosures while integrating heat sinking and electronic functions via laser direct structuring (LDS). Within the ALU4CED concept, we applied an IR-compatible LDS lacquer on aluminum, formed conductive tracks by electroless Cu/Ni/Au metallization, assembled components, and assessed end-of-life recyclability. Controlled remelting trials compared three disassembly levels: complete housings with PCBs and components, housings without PCBs, and housings with only integrated tracks. Metal yield rose from 81.4% for complete assemblies to 93.2% after PCB removal, while leaving integrated LDS tracks did not measurably penalize recovery. Only the complete electronics variant showed critical contamination (Cu = 1.64 wt.% vs. 0.25 wt.% limit for EN AC 4343); after PCB removal, composition remained close to the reference and major elements (Si, Mg, Fe) stayed within specification. Prefil testing indicated very low total inclusion content (0.006/0.001/0.002 mm2·kg−1), confirming high melt cleanliness despite coatings. Following remelting → billet casting → extrusion, tensile properties (Rm ≈ 120–123 MPa, Rp0.2 ≈ 59–61 MPa, A ≈ 29–33%) were comparable to the reference profile. These results demonstrate the technological feasibility of closed-loop recycling for LDS functionalized aluminum housings and inform clear Design-for-Recycling guidance: design for rapid PCB removal, allow LDS layers to remain during melting, and maintain compatibility with the 4343 family to enable efficient internal recycling.