Correction: Sharma et al. Recent Advancements in AI-Enabled Smart Electronics Packaging for Structural Health Monitoring. Metals 2021, 11, 1537
Authors
- Vinamra Sharma (ORCID: https://orcid.org/0000-0002-3070-7512)
- Saurabh Tewari (ORCID: https://orcid.org/0000-0002-7487-833X)
- Bharat Lohani (ORCID: https://orcid.org/0000-0001-8589-192X)
- Susham Biswas (ORCID: https://orcid.org/0000-0002-1056-4980)
- U. D. Dwivedi (ORCID: https://orcid.org/0000-0002-2206-6153)
- Deepak Dwivedi
- Ashutosh Sharma (ORCID: https://orcid.org/0000-0003-0413-4623)
- Jae Pil Jung
Institutions
- University of Seoul (KR)
- Ajou University (KR)
- Indian Institute of Technology Kanpur (IN)
- Rajiv Gandhi Institute of Petroleum Technology (IN)
Publication Details
- Journal
- Metals
- Published
- 2026-05-08
- DOI
- https://doi.org/10.3390/met16050506
- Primary Topic
- Advanced Sensor and Energy Harvesting Materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00