Electric‐Current‐Induced Phase Transformation in Cu <sub>6</sub> Sn <sub>5</sub> Below Its Equilibrium Transition Temperature
below the equilibrium transition temperature and provide a basis for understanding current-assisted phase stability in conductive intermetallics.
Authors
- Shubhayan Mukherjee (ORCID: https://orcid.org/0000-0002-2281-2849)
- Y Liu
- Jun Mizuno
- Shih‐kang Lin (ORCID: https://orcid.org/0000-0002-0832-3213)
Institutions
- National Cheng Kung University (TW)
Publication Details
- Journal
- Advanced Science
- Published
- 2026-05-08
- DOI
- https://doi.org/10.1002/advs.75499
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Science and Technology Council