Investigating the Effect of AlGaN Back Barrier in Buffer Free AlGaN/GaN HEMTs with Stacked HfO2/SiN Passivation for High Frequency Applications

GaN HEMTs are essential devices in high-voltage, fast switching operation in 5G and millimeter-wave applications. This research presents an AlGaN/GaN HEMT without buffer (BF-HEMT) featuring an AlGaN back barrier and stacked HfO2/SiN passivation. The device’s characteristics were evaluated using the Sentaurus TCAD tool. Incorporating a 100 nm AlGaN back barrier with 7% Al mole fraction provides strong two dimensional electron gas (2DEG) confinement suppresses leakage and enhanced RF performance, while causing only minor reductions in drain current and transconductance. The proposed device demonstrates a 3.7-fold increase in current-gain cut-off frequency and a 3.8-fold increase in maximum oscillation frequency over conventional HEMTs. Even with a slight reduction in breakdown voltage, the device demonstrated a notable enhancement in Johnson’s figure of merit (JFOM), reaching 14.96 THz·V. The demonstrated balance between high-frequency response and power capability positions the device as a strong contender for next-generation 5G, mm-wave, and power amplifier technologies.

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Publication Details

Journal
Semiconductors
Published
2026-05-01
DOI
https://doi.org/10.1134/s1063782625604704
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
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article

Investigating the Effect of AlGaN Back Barrier in Buffer Free AlGaN/GaN HEMTs with Stacked HfO2/SiN Passivation for High Frequency Applications

Anil Prasad Dadi, Ellapu Bhanu Prakash, Sushanta Bordoloi, Vijay Maitra et al.
Semiconductors
GaN-based semiconductor devices and materials
article

Investigating the Effect of AlGaN Back Barrier in Buffer Free AlGaN/GaN HEMTs with Stacked HfO2/SiN Passivation for High Frequency Applications

Anil Prasad Dadi, Ellapu Bhanu Prakash, Sushanta Bordoloi, Vijay Maitra, Tathagata Ghose, Ashok Ray
article en

Abstract

GaN HEMTs are essential devices in high-voltage, fast switching operation in 5G and millimeter-wave applications. This research presents an AlGaN/GaN HEMT without buffer (BF-HEMT) featuring an AlGaN back barrier and stacked HfO2/SiN passivation. The device’s characteristics were evaluated using the Sentaurus TCAD tool. Incorporating a 100 nm AlGaN back barrier with 7% Al mole fraction provides strong two dimensional electron gas (2DEG) confinement suppresses leakage and enhanced RF performance, while causing only minor reductions in drain current and transconductance. The proposed device demonstrates a 3.7-fold increase in current-gain cut-off frequency and a 3.8-fold increase in maximum oscillation frequency over conventional HEMTs. Even with a slight reduction in breakdown voltage, the device demonstrated a notable enhancement in Johnson’s figure of merit (JFOM), reaching 14.96 THz·V. The demonstrated balance between high-frequency response and power capability positions the device as a strong contender for next-generation 5G, mm-wave, and power amplifier technologies.

SemiconductorsVol. 60(5)
North Eastern Regional Institute of Science and Technology (IN), Mizoram University (IN), Government of Mizoram (IN)
Affordable and clean energy
Openalex Percentile: Top 9%
GaN-based semiconductor devices and materials
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Investigating the Effect of AlGaN Back Barrier in Buffer Free AlGaN/GaN HEMTs with Stacked HfO2/SiN Passivation for High Frequency Applications — Anil Prasad Dadi, Ellapu Bhanu Prakash, et al. · Semiconductors (2026) | TGRS Research Map | TGRS