Metallic Multilayers Deposited by Bias-Controlled HiPIMS on X-Band Accelerator Components

X-band copper resonating cavities are key components of future pulsed GHz normal-conductive multi-TeV accelerators. High electric field gradients are required for emerging applications; however, as gradients increase, components’ lifetime decreases, primarily due to radiofrequency (RF) breakdown. Coating technologies are being investigated in several laboratories to improve RF structure, performance and lifetime. To this end, we investigated the feasibility of fabricating nanometer-periodic Cu/Mo metallic multilayers on three-dimensional (3D) aluminum mandrels designed to replicate X-band copper resonating cavities. These nanometer-period multilayers are proposed to mitigate surface degradation due to electric breakdown at high accelerating gradients by stabilizing inner cavity surfaces against dislocation evolution and roughening caused by thermo-mechanical fatigue. High-Power Impulse Magnetron Sputtering (HiPIMS) in a bias-controlled dual closed-field magnetron configuration was employed to deposit alternating Mo and Cu nano-layers onto the 3D geometries. Given the complexity of HiPIMS technology, plasma pulse evolution was studied by combining time-resolved optical emission spectroscopy with electrical measurements of the pulse discharge. The influence of the process parameters, particularly the applied DC bias, on film growth was studied using non-destructive microprobe α-particle elastic backscattering spectrometry (µEBS) and scanning transmission electron microscopy (STEM). STEM and µEBS analyses confirmed that Mo layers with thicknesses of approximately 5–35 nm were successfully deposited repeatedly on thicker Cu layers (30–150 nm), preserving individual layer properties with minimal interdiffusion and alloying. The layers were deposited inside trenches with an aspect ratio of 5:1 representative of X-band irises. This technology, coupled with the replica process, could be applied to highly engineered nanostructured coatings for X-band cavity treatment in compact particle accelerator prototypes, as it may improve electrical breakdown lifetime under high accelerating fields, at least for degradation processes driven by the high mobility of copper dislocations.