Impact of Bonding Temperature on the Interfacial Stability and Degradation Mechanisms of Perovskite Solar Cells

This paper investigates the stability of perovskite films under bonding conditions, focusing on the impact of bonding temperature on the electrical, morphological, and elemental characteristics of perovskite solar cells (PSCs) incorporating a barium–strontium titanate (BST) barrier layer. This study aimed to elucidate the interdiffusion phenomena at interfaces and their effect on device performance. We found that increasing the bonding temperature significantly degrades PSC performance, with efficiencies dropping from 21% at 100 °C to 65% at 180 °C relative to unbonded devices. A critical bonding temperature of 150 °C was identified, which correlates with a pronounced drop in short-circuit current and a peak in series resistance, phenomena primarily attributed to severe elemental interdiffusion and defect formation at the interfaces. Morphological (SEM) and elemental (EDS) analyses confirmed the temperature-dependent nature of interdiffusion across the Au/BST/perovskite interfaces. These findings underscore the critical role of bonding temperature in triggering interfacial degradation, a factor that mediates the stability of BST-interfaced PSCs during packaging.