Metal-Ion-Coordinated Conductive Hydrogels for Strain Sensing from Coordination Design to Wearable Applications

Conductive hydrogels have emerged as promising candidates for flexible strain sensors owing to their high water content, low elastic modulus, and intrinsic ionic conductivity. However, conventional hydrogel networks often suffer from an inherent trade-off among conductivity, mechanical robustness, and long-term stability, which limits their practical deployment in wearable sensing scenarios. The introduction of metal–ligand coordination bonds into hydrogel networks offers a versatile strategy to address these challenges: dynamic coordination cross-links can dissipate energy under deformation and reform upon unloading, thereby enhancing toughness, enabling self-healing, and contributing to ionic transport. This review focuses on metal-ion-coordinated conductive hydrogels designed for strain-sensing applications. Representative coordination systems based on Fe3+, Ca2+, Zn2+, Al3+, Cu2+, Ti4+, and Zr4+ are surveyed, with emphasis on their characteristic polymer matrices, ligand chemistries, and network-construction strategies. Key sensing-relevant properties—including ionic conductivity, mechanical stretchability, self-healing capability, interfacial adhesion, freezing resistance, and resistance to dehydration—are discussed in relation to coordination network design. Typical application demonstrations in large-deformation motion monitoring and subtle physiological signal detection are reviewed. Unlike existing reviews that survey conductive hydrogels broadly by conductive mechanism or sensor type, this review takes metal-ion coordination as the central organizing principle and systematically traces its influence across the full design chain—from ion–ligand coordination chemistry through network architecture to macroscopic sensing output. By comparatively analyzing seven representative metal-ion systems within a unified framework, this work aims to clarify how the choice of metal ion governs the interplay among conductivity, mechanical robustness, self-healing, and strain sensitivity—a perspective that has not yet been systematically addressed in prior reviews. Finally, current challenges—including the conductivity–mechanics coupling bottleneck, insufficient long-term stability, biosafety concerns for skin-contact deployment, the lack of standardized evaluation protocols, and device-integration barriers—are identified, and future directions for this field are outlined.