Influence of Adding a Small Quantity of Rose Quartz on the Thermal Stability and Adhesive Properties of Silicone Pressure-Sensitive Adhesives
Silicone pressure-sensitive adhesives are a prominent group of adhesive materials used in many contemporary industrial sectors. This is due to their high resistance to difficult operating conditions, especially high temperatures. They are used, among other areas, in the automotive industry or in power engineering, as fastening or insulation systems operating at high temperatures. Previous studies have demonstrated the beneficial effect of mineral fillers on further increases in thermal resistance and dimensional stability of silicone pressure-sensitive adhesives. This paper presents the results of research on the effect of adding rose quartz as a filler to silicone pressure-sensitive adhesives based on polydimethylsiloxanes, on the adhesion parameters of the obtained adhesives and their thermal resistance and dimensional stability at elevated temperatures. The self-adhesive tapes obtained showed increased resistance and thermal stability while maintaining the required performance parameters. Among the tested compositions, optimal PSA parameters were achieved for Q2-7358 resin filled with 0.5 pph of rose quartz particles: adhesion exceeded industrial requirements by more than 15%, and tack met those requirements. Furthermore, low (and consistent) shrinkage (0.4% after one week) and cohesion—evaluated as hold time > 72 h—were recorded. As the most important parameter for studied compositions, thermal resistance (SAFT) substantially increased (>225 h) in comparison to neat resin (150 h).
Authors
- Marcin Bartkowiak (ORCID: https://orcid.org/0000-0002-4764-5485)
- Adrian Krzysztof Antosik (ORCID: https://orcid.org/0000-0002-3954-6612)
Institutions
- West Pomeranian University of Technology in Szczecin (PL)
Publication Details
- Journal
- Materials
- Published
- 2026-05-01
- DOI
- https://doi.org/10.3390/ma19091865
- Primary Topic
- Silicone and Siloxane Chemistry
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Ministerstwo Edukacji i Nauki