Digital Twin-Driven Industry-Education Integration Model: A Case Study of IC Packaging & Testing Training Course Development

The rapid digital transformation of the integrated circuit (IC) industry has intensified the structural mismatch between talent supply and demand. Digital twin (DT) technology, which enables bidirectional mapping between physical and digital spaces, offers a promising solution to three persistent problems in vocational training: difficult technology implementation, lack of teaching resources, and fragmented competency development. Based on the collaboration between Wuhan Vocational and Technical University and Boxin Semiconductor Technology Co., Ltd., this paper constructs a progressive “Technology–Scenario–Competency” cultivation system. Key components include a hierarchical competency development system, job competency map-based curriculum design, and modular training combining virtual and physical elements, supported by a dynamic resource updating mechanism. Results show that the DT-driven model shortens students’ job adaptation period significantly and enables rapid translation of industrial technologies into teaching content, providing a replicable paradigm for vocational education digital transformation.