Nonequilibrium Solidification Kinetics Engineer Rich Microstructures and Strong Texture in <i>p</i> -Type Bi <sub>0.5</sub> Sb <sub>1.5</sub> Te <sub>3</sub> Ribbons
of 1.54 at 400 K. This work links solidification kinetics to interfacial defect chemistry and thermoelectric performance in rapidly solidified alloys.
Authors
- Yuhan Qu (ORCID: https://orcid.org/0009-0000-0647-5224)
- Hao Zhu (ORCID: https://orcid.org/0000-0003-4411-0933)
- Huiyuan Geng (ORCID: https://orcid.org/0000-0002-5269-7984)
- Tianshi Hu (ORCID: https://orcid.org/0000-0001-6479-758X)
- Haidong Hao
- Qizhi Yang (ORCID: https://orcid.org/0009-0003-6344-3175)
- D A Golosov
- Xiubo Tian
Institutions
- The Welding Institute (GB)
- Harbin Institute of Technology (CN)
- Belarusian State University of Informatics and Radioelectronics (BY)
Publication Details
- Journal
- Langmuir
- Published
- 2026-05-01
- DOI
- https://doi.org/10.1021/acs.langmuir.6c01597
- Primary Topic
- Advanced Thermoelectric Materials and Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China