Orthogonal Monomer Design Enables Sequentially Cured Hybrid Polymers for Ultralow‐Dielectric Applications
> 400°C), hydrophobic surfaces (water contact angle > 100°), and robust mechanical integrity. This work highlights a generalizable chemical design paradigm that links orthogonal monomer reactivity to nanoscale structure control and multifunctional dielectric performance, offering a promising pathway for advanced electronic packaging materials.
Authors
- Wenxin Fu (ORCID: https://orcid.org/0000-0002-8986-8310)
- Wei Zhang (ORCID: https://orcid.org/0000-0001-7800-3189)
- Qi Wang (ORCID: https://orcid.org/0000-0003-3741-8091)
- Rui Xue (ORCID: https://orcid.org/0000-0002-0695-0678)
- Xiaohao Tang
- Yan He
- Meng Xie
Institutions
- State Key Laboratory of Polymer Physics and Chemistry (CN)
- University of Chinese Academy of Sciences (CN)
Publication Details
- Journal
- Advanced Materials
- Published
- 2026-04-27
- DOI
- https://doi.org/10.1002/adma.202600007
- Primary Topic
- Dielectric materials and actuators
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China
- National Key Research and Development Program of China