Analytic Hierarchy Process-Based Multi-Criteria Optimization of Functionally Graded Thermoplastic Architectures for Enhanced Viscoelastic Energy Dissipation

Functionally graded multi-material thermoplastic architectures provide a promising route for tailoring viscoelastic energy dissipation through controlled phase contrast and interfacial interactions. However, rational selection of optimal material compositions remains challenging due to competing requirements among stiffness, damping efficiency, thermal stability, and processability. The absence of a quantitative decision framework often limits systematic design of architected polymer systems. This study proposes an Analytic Hierarchy Process (AHP)-based multi-criteria decision model to identify the optimal rigid–elastic thermoplastic composition for enhanced damping performance. Nine performance criteria were considered, including storage modulus, loss factor, damping bandwidth, interfacial adhesion strength, elongation at break, impact resistance, glass transition temperature, thermal stability, and printability. Fourteen alternative material configurations combining different rigid phases, elastomeric interlayers, filler contents, and layer thickness ratios were evaluated. Pairwise comparison matrices were constructed based on experimentally measured thermomechanical data and literature-reported values, and consistency ratios were maintained below 0.1 to ensure decision reliability. Numerical results indicate that a graded PLA/soft-TPU/PLA architecture with optimized layer thickness ratio achieved the highest global priority weight (0.431), outperforming the baseline PLA/TPU system by approximately ~25–30% in overall performance index. Sensitivity analysis confirmed ranking robustness across variations in damping and stiffness weighting factors. The proposed framework establishes a systematic methodology for polymer material selection and multi-material architectural optimization, enabling data-driven design of thermoplastic systems with tunable viscoelastic performance.