Improved deconstruction of components in nuclear power plants through deterministic grain arrangement in diamond wire grinding

Abstract In conventional grinding processes, tools with deterministic abrasive grain arrangements can significantly reduce forces and temperatures compared to random distributions. New additive manufacturing processes enables to produce grinding segments with deterministic grain arrangements for diamond wire grinding. This study investigates the effect of deterministic abrasive grain arrangement on the performance of diamond wire tools for dry cut-off of steel. Two additively manufactured, sintered-bond wires with deterministic grain patterns were compared with an electroplated and a sintered wire with stochastic grain distributions. Performance was assessed by specific material removal rate A′ w , process forces, wire temperature, and vibration amplitude. Although they do not achieve the same material removal rate as the electroplated reference, the new tools offer clear advantages over random grain distribution. Among sintered tools, deterministic abrasive grain arrangement delivered higher material removal rate and less vibrations as well as increased the force ratio relative to the stochastic reference.