Phase-Field Damage Modeling of Electromechanical Fracture in MEMS Piezoelectric Films
increases from 0° to 90°. These results demonstrate that pre-existing defects and electromechanical loading jointly govern crack evolution in MEMS piezoelectric thin films. The present study provides a useful numerical tool for fracture analysis, reliability assessment, and structural design of MEMS piezoelectric devices containing manufacturing defects.
Authors
- Jiaxing Cheng (ORCID: https://orcid.org/0000-0001-8354-6452)
- Xuanyi Chen (ORCID: https://orcid.org/0000-0001-7883-5831)
- Yangjie Shi (ORCID: https://orcid.org/0000-0001-9944-1364)
- Yu Xue (ORCID: https://orcid.org/0009-0001-3691-2509)
- Yuhan Zhang (ORCID: https://orcid.org/0009-0001-8687-9575)
Institutions
- Liaoning Technical University (CN)
- Yangzhou Vocational University (CN)
- Yangzhou University (CN)
Publication Details
- Journal
- Materials
- Published
- 2026-04-21
- DOI
- https://doi.org/10.3390/ma19081662
- Primary Topic
- Numerical methods in engineering
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Natural Science Foundation of Yangzhou City
- Government of Jiangsu Province