A step closer to circular packaging: REDYSIGN prototypes advance towards real- world validation
Consortium partners gathered at McAirlaid’s facilities in Selm to assess the developed prototypes, address key challenges in innovative processes, and align on the best path towards successful demonstration.
Authors
- Álvaro Tejado (ORCID: https://orcid.org/0000-0001-6261-1948)
- Ana Báscones Ursúa
Institutions
- Tecnalia (ES)
- Colciencias (CO)
Publication Details
- Journal
- Zenodo (CERN European Organization for Nuclear Research)
- Published
- 2026-04-17
- DOI
- https://doi.org/10.5281/zenodo.19633544
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00