Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation
, thereby overcoming the traditional thermal-mechanical trade-off. Practical cooling tests confirm the superior performance of GMP60. It lowers the central processing unit (CPU) core temperature by 12°C under full-load operation and reduces the power chip temperature by 18.2°C. This work establishes a new paradigm for overcoming thermal-mechanical mismatches in next-generation electronic thermal management.
Authors
- Litao Sun (ORCID: https://orcid.org/0000-0002-2750-5004)
- Hengchang Bi (ORCID: https://orcid.org/0000-0002-8548-8708)
- Junhao Shen (ORCID: https://orcid.org/0000-0003-3912-5620)
- Yaru Wang (ORCID: https://orcid.org/0000-0002-5443-9276)
- Sijia Wu
- Xu Ran (ORCID: https://orcid.org/0009-0009-6648-8989)
- Xing Wu (ORCID: https://orcid.org/0000-0001-5876-2620)
- Hejun Wang
Institutions
- Ministry of Education (BD)
- East China Normal University (CN)
Publication Details
- Journal
- Advanced Science
- Published
- 2026-04-17
- DOI
- https://doi.org/10.1002/advs.75359
- Primary Topic
- Thermal properties of materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China