Facile Strategy Enabling Fluorine-Free Polyimides with Ultralow Dielectric Loss and Thermal Expansion Close to Copper
= 485-500 °C; tensile strength = 68-157 MPa). These results position TAHQ-based, fluorine-free ester-ether copolyimides incorporating 3,4-ODA and m-tolidine as practical ultralow-loss dielectrics with copper-matched CTEs for high-frequency electronic hardware.
Authors
- Dula Daksa Ejeta (ORCID: https://orcid.org/0000-0002-2762-066X)
- Kamani Sudhir K. Reddy (ORCID: https://orcid.org/0000-0001-7631-5517)
- Yi-Hsin Chang
- Yu-Hsin Liu
- Ching-Hsuan Lin (ORCID: https://orcid.org/0000-0002-7435-4026)
- Wan-Ling Hsiao
Institutions
- National Chung Hsing University (TW)
- National Taipei University (TW)
Publication Details
- Journal
- ACS Applied Materials & Interfaces
- Published
- 2026-04-17
- DOI
- https://doi.org/10.1021/acsami.6c02417
- Citations
- 1
- Primary Topic
- Synthesis and properties of polymers
- Type
- article
- Field-Weighted Citation Impact
- 8.92
Funders
- Ministry of Education of the People's Republic of China
- National Science and Technology Council