Impact of the micro heat sink internal structure on the heat and mass transfer

Due to the rapid development of the microelectronic industry, new efficient cooling systems are required. The most promising is the liquid cooling technology with the introduction of cooling devices directly into the microelectronic chips. In this paper, we study the liquid flow and its integral characteristics in microchannels with pin fin arrays. Various internal geometries of microchannels are considered, including both uniformly distributed cylindrical pins and systems with two packing scales. The effect of changing the pin spatial distribution in microchannels with the same void coefficient on the flow rate variation, velocity field and temperature distribution is shown. The results obtained can be used in the design of microfluidic heat sinks.