Ga-Based Liquid Metals: Advances in Interface Thermal and Electrical Regulations for Power Electronics Integration

Ga-based liquid metals (GLMs) have been considered as promising thermal and electrical interface materials for advanced power electronics, combining high thermal conductivity (some types even >30 W/m·K) with fluidity at room temperature. This review systematically evaluates the dual roles of GLMs in power electronics packaging. Their function in thermal management as both thermal interface materials and active cooling media is first examined, followed by an analysis of their capabilities in forming electrical interconnections via low-temperature bonding in fluidic and solid states. However, reliable integration remains challenging due to interfacial reactions and instability with metal substrates. We discuss interfacial mechanisms with Cu and common metallizations, along with emerging regulation strategies such as surface coatings and process acceleration techniques. By examining these interfacial interactions, this work aims to guide the selection and design of surface modification strategies to either promote or inhibit reactions as needed, supporting the development of robust power electronic packaging.