Preparation of Bio-Based Phenalkamine Curing Agent for the Application of Formaldehyde-Free Epoxy Resin Adhesives
) of 38.9 and 48.8 °C for the room-temperature cured and stepwise thermally cured groups, respectively. Vertical burning tests showed rapid self-extinguishment of approximately 3 s and no ignition-causing dripping, indicating favorable flame retardancy of the adhesive system. This work provides experimental evidence supporting the development of formaldehyde-free, low-environmental-burden, room-temperature-curable epoxy adhesive systems.
Authors
- Yi Fan (ORCID: https://orcid.org/0000-0003-0607-146X)
- Y Chen
- Hui Zhang (ORCID: https://orcid.org/0000-0002-3773-5460)
- Rentong Yu
- Erbin Su
Institutions
- Hainan University (CN)
- LRM Industries International (United States) (US)
Publication Details
- Journal
- ACS Omega
- Published
- 2026-04-16
- DOI
- https://doi.org/10.1021/acsomega.6c01553
- Primary Topic
- Lignin and Wood Chemistry
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China
- Natural Science Foundation of Hainan Province