Hardware-minimal arm-current stress test for double half-bridge submodules in modular multilevel converters
The double submodule (DSM), which integrates two series-connected half-bridges within a single submodule, has gained attention as a compact and space-efficient building block for the modular multilevel converters (MMCs) used in constrained environments such as urban power-conversion stations and electric ship propulsion systems. Reliable DSM operation must be verified under realistic loading conditions. However, existing submodule (SM) test approaches, including mission profile emulations (MPEs) and power-hardware-in-the-loop simulations (PHILS), are unsuitable for DSMs. When applied to DSMs, these approaches require a high-voltage power amplifier with an output capability exceeding twice the dc rating of an equivalent single SM, which significantly increases implementation complexity. This paper proposes a DSM-based loading-test method that eliminates the need for an auxiliary high-voltage power amplifier. Two DSMs are interconnected through an interface inductor to synthesize arm-current-shaped waveforms, while an auxiliary dc source compensates only the energy loss to sustain operation. Experimental results obtained from laboratory-scale DSM hardware demonstrate that the proposed method reproduces representative current stress, offering a practical and hardware-minimal solution for DSM loading tests.
Authors
- Jae-Jung Jung (ORCID: https://orcid.org/0000-0002-0345-1638)
- Sanghyun KIM
- Donghwan Lee
- Da-Yae Yoon
- Shenghui Cui
Institutions
- Electric Power Research Institute (US)
- Kyungpook National University (KR)
- Daewoo Shipbuilding and Marine Engineering (South Korea) (KR)
Publication Details
- Journal
- Journal of Power Electronics
- Published
- 2026-04-13
- DOI
- https://doi.org/10.1007/s43236-026-01328-x
- Primary Topic
- HVDC Systems and Fault Protection
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Kyungpook National University
- Ministry of Trade, Industry and Energy