Two-Step Polishing Technique for Flat and Smooth Copper Substrates by Electrochemical and Chemical Etching
50 mm workpiece (valid dimensions = 90% of the central region) is reduced from 2.678 μm to 0.384 μm. This study has great implications for further understanding the mechanism of Jet-ECM and EGCP, which expands the applications of stress-free polishing to solve the processing problems of the low-rigidity workpiece.
Authors
- K. Wang
- Yuan Li (ORCID: https://orcid.org/0000-0002-3897-9942)
- Huirong Shi
- Xinghua Chen
- Boju Hou
- Ming Zhang
- Peng Xu
- Xutong Liu
Institutions
- Dalian University of Technology (CN)
- Lanzhou Jiaotong University (CN)
Publication Details
- Journal
- Micromachines
- Published
- 2026-04-12
- DOI
- https://doi.org/10.3390/mi17040466
- Primary Topic
- Advanced Surface Polishing Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China
- Dalian University of Technology
- Natural Science Foundation of Gansu Province
- Lanzhou Science and Technology Bureau
- Lanzhou Jiaotong University